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| LESHAN RADIO COMPANY, LTD. High -Speed Switching Diode MMDL914T1 1 CATHODE 2 ANODE 1 2 CASE 477- 02, STYLE 1 SOD- 323 MAXIMUM RATINGS Rating Reverse Voltage Forward Current Peak Forward Surge Current Symbol VR IF I FM(surge) Value 100 200 500 Unit Vdc mAdc mAdc THERMAL CHARACTERISTICS Characteristic Total Device Dissipation FR-5 Board,* T A = 25C Derate above 25C Thermal Resistance Junction to Ambient Junction and Storage Temperature **FR-4 Minimum Pad Symbol PD Max 200 1.57 635 150 Unit mW mW/C C/W C R JA T J , T stg DEVICE MARKING MMDL914T1 = 5D ELECTRICAL CHARACTERISTICS (T A = 25C unless otherwise noted) Characteristic Symbol Min Max Unit OFFCHARACTERISTICS Reverse Breakdown Voltage (I R = 100 Adc) Reverse Voltage Leakage Current (V R = 20Vdc) (V R = 75Vdc) Diode Voltage (V R =0, f =1.0MHz ) Forward Voltage (I F = 10 mAdc) Reverse Recovery Time (I F = I R = 10 mAdc ) (Figure 1) V (BR) IR -- -- CT V F 100 -- Vdc 25 5.0 4.0 1.0 4.0 nAdc Adc pF Vdc ns -- -- -- t rr S5-1/3 LESHAN RADIO COMPANY, LTD. MMDL914T1 +10 V 820 2.0 k 0.1F tr tp 10% t IF t rr t 100 H IF 0.1 F 50 OUTPUT PULSE GENERATOR DUT 50 INPUT SAMPLING OSCILLOSCOPE 90% i R(REC) = 1.0 mA INPUT SIGNAL V R IR OUTPUT PULSE (I F = I R = 10 mA; MEASURED at i R(REC) = 1.0 mA) Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (I F ) of 10mA. Notes: 2. Input pulse is adjusted so I R(peak) is equal to 10mA. Notes: 3. t p t rr Figure 1. Recovery Time Equivalent Test Circuit 100 10 T A = 150C I F , FORWARD CURRENT (mA) T A = 85C 10 I R , REVERSE CURRENT (A) T A = -40C 1.0 T A = 125C T A = 85C 0.1 T A = 25C 1.0 T A = 55C 0.01 T A = 25C 0.001 0 10 20 30 40 50 0.1 0.2 0.4 0.6 0.8 1.0 1.2 V F , FORWARD VOLTAGE (VOLTS) V R , REVERSE VOLTAGE (VOLTS) Figure 2. Forward Voltage Figure 3. Leakage Current 0.68 C D , DIODE CAPACITANCE (pF) 0.64 0.60 0.56 0.52 0 0.2 0.4 0.6 0.8 V R , REVERSE VOLTAGE (VOLTS) Figure 4. Capacitance S5-2/3 LESHAN RADIO COMPANY, LTD. MMDL914T1 PACKAGE DIMENSIONS SOD-323 PLASTIC PACKAGE CASE 477-02 ISSUE A K A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. MILLIMETERS DIM E D 1 2 B INCHES MIN MAX 0.063 0.071 0.045 0.053 0.031 0.039 0.010 0.016 0.006 REF 0.000 0.004 0.0035 0.0070 0.091 0.106 C J NOTE 3 H A B C D E H J K MIN MAX 1.60 1.80 1.15 1.35 0.80 1.00 0.25 0.40 0.15 REF 0.00 0.10 0.089 0.177 2.30 2.70 0.63 mm 0.025'' STYLE 1: PIN 1. CATHODE 2. ANODE 1.60 mm 0.063'' 2.85 mm 0.112'' mm inches 0.83 mm 0.033'' ( ) SOD-323 Soldering Footprint S5-3/3 |
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